Unimicron Technology Corporation
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  • About Unimicron
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  • Technology
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  • Products
    • PCB
      • HDI
      • ELIC
      • Multi-layer PCB
      • Rigid Flex PCB
    • IC Carrier
      • FCCSP
      • FCBGA
      • CSP
      • Memory Module
      • Coreless
    • Connector
      • PCBeam
      • X-Beam
    • TP & ECRM
      • Glass Type
      • Film Type
      • EC Mirror
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    • Policy & Action
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    • TQM's Implement
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      • Evolution
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      • Unimicron Life
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      • Corporate Regulations
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      • Shareholders' Meeting
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      • Major Shareholders
  • Contact us
Languages
繁體中文
English

Connector

  • Home
  • Products
  • Connector

PCBeam

Production Information

Features

  • Low Pofile
  • Highest Performance
  • Extremely Rugged
  • SMT Process
  • Flixable design with FPC & I/O Port

Benefits

  • 1mm thickness after assembly
  • Excellent signal integrity to beyond 30 GHz
  • One-step high reliability screw assembly
  • Offer pick & place process
  • High Speed & High Power FPC link between PC Boards
  • Finished assembly allows reliable and rapid USB3.1 Type C implementation

Applications

  • Smart Phone, UltraBook, Tablet (2 in 1 PC)
  • Gamming Book, Optical Transceiver
  • High Performance Server, Automobile, Medical
  • Communication System
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© Unimicron Corporation All Rights Reserved |  Last update : 2020.03.13
© Unimicron Corporation All Rights Reserved
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