Unimicron Technology Corporation
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IC Carrier

  • Home
  • Products
  • IC Carrier

Coreless

Production Information

Features

  • Layer count : 1L / 2L / 3L / 4L , etc.
  • Thickness: 100 um (1.5L) ~ 225 um (5L)
  • Embedded trace (Line & Space 8/10 um)

Benefits

  • Thin thickness for Low Z height

Applications

  • Smart Devices
  • High-end CPU/GPU
  • ASIC Devices
  • Game Console
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© Unimicron Corporation All Rights Reserved |  Last update : 2020.03.13
© Unimicron Corporation All Rights Reserved
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