Unimicron Technology Corporation
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IC Carrier

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CSP

Production Information

Features

  • Package Size: 3 x 3mm up to 19 x 19 mm
  • Thickness: 0.10mm - 0.36mm
  • Ball Pitch: 0.8mm, 0.65mm, 0.5mm, 0.4mm, 0.3mm
  • Line & Space down to 12/16 um
  • RoHS compliance materials
  • Layer count from 2 layer up to HDI 6 layers
  • Structure: single die, multiple die, POP, Embeded Active Die
  • Designed for strict reliability test including Drop Test

Benefits

  • Small scale and light weight
  • Lowe inductance, low capacitance and enhanced electrical performance

Applications

  • Biometrics
  • MEMs
  • CMOS Image Sensor
  • Power Management
  • MCU/ECU
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© Unimicron Corporation All Rights Reserved |  Last update : 2020.03.13
© Unimicron Corporation All Rights Reserved
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