Unimicron Technology Corporation
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IC Carrier

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  • IC Carrier

FCCSP

Production Information

Features

  • Package Size: 3 x 3 mm up to 15 x 15 mm
  • Line & Space 12/16um
  • Bump Pitch down to 130um
  • Impedance control for critical signal traces
  • Structure range from 2 layers to 14 layers
  • For products demanding high density and reliability
  • For small package size with high electric performance product

Benefits

  • High I/O Count and Short Interconnects
  • High layout density
  • Cost reduction due to smaller package size

Applications

  • Portable Smart Devices e.g. Smartphone
  • Consumer Electronics
  • 5G application
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© Unimicron Corporation All Rights Reserved |  Last update : 2020.03.13
© Unimicron Corporation All Rights Reserved
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