HDI
Production Information
Features
- Suitable for BGA with smaller ball pitch and higher I/O counts
- Fine line, micro via and registration technologies capable of 0.3 mm ball pitch, Increase routing density in complicated design
- Thin board capabilities, copper filled via and excellent mounting stability and reliability
- Lower Dk / Df material enables better signal transmission performance
- Low CTE & High Tg material fulfills high reliability demand
- Qualified material and surface treatment for Lead-free process
Benefits
- World’s largest HDI manufacturer
- Over 10 years’ experience in HDI manufacturing
- Well experienced manufacturer with good yield
- From both China and Taiwan, multiple plants increase production output in short time
Applications
- Smartphone, Feature Phone, Tablet, Ultrabook
- e-Reader, MP3 Player, GPS, Portable Game Console
- DSC, Camcorder, LCD Module